The core of the Bluetooth module is its chip. With the requirement of miniaturization, the size of the chip is constantly shrinking. This puts extremely high demands on the precision of the chip manufacturing process. For example, in the photolithography process, it is necessary to use a shorter wavelength light source and more precise photolithography equipment to achieve a smaller photolithography line width, so as to integrate more transistors and functional modules on a limited chip area. At present, advanced chip manufacturing processes have been able to achieve nanometer-level precision, but every further reduction in size requires overcoming the limits of photolithography technology, etching technology, etc. to ensure that the performance and stability of the chip are not affected.
In order to achieve the miniaturization of a single Bluetooth module, a multi-layer circuit board design is usually required to compactly layout various electronic components on a multi-layer circuit board. This requires precise control of the alignment accuracy and insulation performance between the layers during the circuit board manufacturing process. At the same time, the increased wiring density of the multi-layer circuit board will also bring about problems such as signal interference and heat dissipation. Therefore, more advanced wiring technology and electromagnetic shielding measures are needed to ensure that the performance of the Bluetooth module is not affected. In addition, the manufacturing process of the multi-layer circuit board also needs to ensure the reliability of the connection between the layers to avoid problems such as cold soldering and short circuits.
As the size of Bluetooth modules decreases, the electronic components used are becoming more and more miniaturized, such as micro capacitors, resistors, inductors, etc. The assembly and welding of these micro components require high-precision equipment and processes. During the assembly process, precision pick-and-place equipment is required to accurately place the components at the designated position on the circuit board. When welding, the welding temperature, time and amount of welding materials must be accurately controlled to ensure the welding quality. Due to the small size of micro components, problems such as cold soldering, leaking soldering or short circuits are prone to occur during welding, which places high demands on the stability and reliability of the welding process.
The packaging of Bluetooth modules must not only protect the internal chips and electronic components from the influence of the external environment, but also reduce the packaging volume as much as possible. Traditional packaging technology faces some limitations in miniaturization, such as the thickness of the packaging material, the layout of the pins, etc. In order to achieve volume miniaturization, new packaging materials and packaging structures need to be adopted. For example, ultra-thin packaging materials, flip-chip packaging technology, etc. are used to reduce the packaging volume and improve the integration. At the same time, the heat dissipation problem needs to be solved during the packaging process to ensure that the Bluetooth module can effectively dissipate heat when working to ensure its performance and stability.
In the process of miniaturization of single bluetooth module, the distance between components is reduced and the signal transmission path is shortened, which may lead to increased signal interference. In order to ensure the performance of the Bluetooth module, effective anti-interference measures need to be taken in the manufacturing process. For example, the components should be reasonably laid out to separate sensitive components from interference sources; shielding technology should be used to shield key signal lines; and the wiring design of the circuit board should be optimized to reduce crosstalk between signals. In addition, electromagnetic compatibility design and testing are required to ensure that the Bluetooth module can work stably in various electromagnetic environments.
With the increase in integration, the single bluetooth module will generate more heat when working. The miniaturized design makes the heat dissipation space limited, and the heat dissipation problem becomes more prominent. If the heat dissipation problem cannot be effectively solved, the module temperature will rise, thereby affecting its performance and life. In the manufacturing process, materials with high thermal conductivity, such as heat sinks, thermal conductive adhesives, etc., need to be used to quickly conduct heat away. At the same time, it is also necessary to optimize the structural design of the module, increase the heat dissipation channel, and improve the heat dissipation efficiency.
After the miniaturization and integration of the single bluetooth module, due to the complexity of the manufacturing process and high precision requirements, its quality inspection and reliability verification also face greater challenges. Traditional detection methods may not meet the detection needs of miniaturized modules, and more advanced detection technologies are needed, such as high-precision optical detection, electron microscope detection, X-ray detection, etc., to detect tiny defects and faults inside the module. In addition, strict reliability tests are also required, such as high temperature, low temperature, humidity, vibration and other environmental tests, to ensure that the Bluetooth module can work stably and reliably in various practical application environments.
